About The Shimadzu Institute Nanotechnology Research Center

The University of Texas at Arlington is home to the preeminent university-based nanotechnology research, development and teaching facility in North Texas.

The Nanotechnology Research & Education Center is an interdisciplinary resource open to scientists within and outside of the University. Research activities are conducted through mutually-beneficial associations of chemistry, electrical engineering, mechanical and aerospace engineering, materials science and physics faculty, graduate students and research assistants at UTA, as well as collaborative efforts with investigators at other universities and in the private sector.

The Shimadzu Institute Nanotechnology Research Center provides a variety of specialized research and teaching labs. The facility includes a 10,000 square foot, class 100 cleanroom including wet chemical labs. Additional space is devoted to laboratories containing a scanning electron microscope (SEM) equipped with energy dispersive x-ray spectroscopy (EDS), a scanning tunnel microscope (STM), a focus ion beam (FIB), and an E-Beam writer.

Research activities are conducted through mutually beneficial associations of faculty, students and researchers from the departments of chemistry, electrical engineering, mechanical and aerospace engineering, materials science, bioengineering, and physics at the University of Texas at Arlington. Furthermore, the center also hosts research investigators from other universities and industry.

Facility users are dedicated to furthering knowledge and promoting development across all sciences and engineering disciplines in the micrometer and nanometer scale. Among the research topics pursued within the center are:

Healthcare

• Biomedical Micro-Electro-Mechanical systems (Bio-MEMS)

• Optical Bio and Chemical Sensor

• Nanopores and Micropores for molecule and cell identification

Renewable Energy

• Advanced Solar Cell Materials/Energy

• Plasmonic Nanostructures

• Vibrational Energy Harvesting Devices

• Micros-scale Heat Transport/Dissipation/Conversion

 

Wide Application Sensor Systems

• Nano-Electro-Mechanical Systems

• Flexible Nanoelectronics

• Single Electron Devices

• Quasi-Optical Wireless Communication/Radar Components and Systems

• Semiconductor Lasers

 

Our Instrumentation

Electron Microscopy

is a method for obtaining high resolution images of wide variety of research specimens at high and low magnification without sacrificing depth of focus. It is used in electromechanical research to investigate the detailed structure of cutting edge fabrication processes and forensic research applications, encompassing a diverse range of practical applications. The high resolution of EM images is a proven technique in modern materials science, investigations into nanotubes and nanofibres, high temperature superconductors, mesoporous architectures and alloy strength, all rely heavily on the use of electron microscopy for research and investigation. Researchers from any material science industry, from aerospace, chemistry or electronics and energy usage, have the ability to examine a wide range of materials to help gain insight into the effectiveness of new production and fabrication methods.

Photolithography

is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical "photoresist", or simply "resist," on the substrate. A series of chemical treatments then either engraves the exposure pattern into the material or enables deposition of a new material in the desired pattern upon the material underneath the photo resist. For example, in complex integrated circuits, a modern CMOS wafer will go through the photolithographic cycle up to 50 times.

Ion-beam & Electron-beam lithography

Ion-beam lithography is the practice of scanning a focused beam of ions in a patterned fashion across a surface in order to create very small structures such as integrated circuits or other nanostructures. This technique has been found to be useful for transferring high-fidelity patterns on three-dimensional surfaces. Ion-beam lithography offers higher resolution patterning than UV, X-ray, or electron beam lithography because these heavier particles have more momentum. This gives the ion beam a smaller wavelength than even an e-beam and therefore almost no diffraction. The momentum also reduces scattering in the target and in any residual gas. There is also a reduced potential radiation effect to sensitive underlying structures compared to x-ray and e-beam lithography.

Electron-beam lithography is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (exposing). The electron beam changes the solubility of the resist, enabling selective removal of either the exposed or non-exposed regions of the resist by immersing it in a solvent (developing). The purpose, as with photolithography, is to create very small structures in the resist that can subsequently be transferred to the substrate material, often by etching. The primary advantage of electron-beam lithography is that it can draw custom patterns (direct-write) with sub-10 nm resolution. This form of maskless lithography has high resolution and low throughput, limiting its usage to photomask fabrication, low-volume production of semiconductor devices, and research and development.

Instrumention Links

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Visit The Center

Shimadzu Institute Nanotechnology Research Center at The University Of Texas at Arlington

The center is located on the UTA campus at

Nanofab Building (NANO)
500 South Cooper St.
Arlington, TX 76019- 0065